This week, these five stocks have the worst ratings in Analyst Earnings Revisions, one of the eight Fundamental Categories on Portfolio Grader.
Willbros Group, Inc. () provides engineering and construction services to the oil, gas, refinery, petrochemical and power industries with a focus on infrastructure such as oil and gas pipeline systems, electric transmission and distribution services and refinery downstream markets. WG also gets F’s in Earnings Growth, Earnings Momentum and Sales Growth. .
Top 10 Semiconductor Stocks For 2015: NVIDIA Corporation(NVDA)
NVIDIA Corporation provides visual computing, high performance computing, and mobile computing solutions that generate interactive graphics on various devices ranging from tablets and smart phones to notebooks and workstations. It operates in three segments: Graphic Processing Unit (GPU), Professional Solutions Business (PSB), and Consumer Products Business (CPB). The GPU segment offers GeForce discrete and chipset products, which support desktop and notebook personal computers plus memory products. The PSB segment provides its Quadro professional workstation products and other professional graphics products, including its NVIDIA Tesla high-performance computing products used in the manufacturing, entertainment, medical, science, and aerospace industries. The CPB segment offers Tegra mobile products, which support tablets, smartphones, personal media players, Internet television, automotive navigation, and other similar devices. This segment also licenses video game consol es and other digital consumer electronics devices. The company sells its products to original equipment manufacturers, original design manufacturers, add-in-card manufacturers, consumer electronics companies, and system builders worldwide that utilize its processors as a core component of their entertainment, business, and professional solutions. NVIDIA Corporation was founded in 1993 and is headquartered in Santa Clara, California.
Advisors' Opinion:- [By Evan Niu, CFA]
NVIDIA (NASDAQ: NVDA ) has brought its advanced Kepler GPU architecture to a mobile chip in the Tegra K1. It's also looking forward to the release of its Denver CPUs, available in 32- and 64-bit flavors later this year.
Top 10 Semiconductor Stocks For 2015: Intermolecular Inc (IMI)
Intermolecular, Inc. (Intermolecular), incorporated on June 16, 2004, is engaged in research and development and time-to-market for the semiconductor and clean-energy industries. The Company, through paid collaborative development programs (CDPs) with its customers, develops technology and intellectual property (IP) for its customers focused on advanced materials, processes, integration and device architectures. The Company provides its customers with technology through various fee arrangements and grants them rights to associated IP, primarily through royalty-bearing licenses. Through paid CDPs and its own development, the Company has established a portfolio of greater than 1,000 patents and patent applications. Its approach is broadly applicable to high-volume integrated device markets, which include the markets for semiconductors, flat glass coatings and glass-based devices, solar cells, light-emitting diodes (LEDs), flat-panel displays, advanced batteries and other energy efficiency applications.
As of December 31, 2012, the Company targets large, high-volume semiconductor and high-growth emerging clean energy markets, including DRAM, non-volatile memory (including flash memory and embedded memory), complex logic, flat glass coatings and glass-based devices, solar cells, LEDs and other energy efficiency applications. The Company�� customers include ATMI, Inc. (ATMI), Elpida Memory, Inc. (Elpida), First Solar. Inc. (First), GLOBALFOUNDRIES Singapore Pte. Ltd (GLOBALFOUNDRIES), Guardian Industries Corp. (Guardian), SanDisk Corporation (SanDisk), Taiwan Semiconductor Manufacturing Company (TSMC) and Toshiba Corporation (Toshiba). For the year ended December 31, 2012, the Company has received the majority of its revenue from customers in DRAM, flash memory, complex logic and energy-efficient applications in flat glass. The elements in HPC platform include Tempus HPC processing, automated characterization, and informatics and analysis software. Tempus HPC processing are used to process ! different experiments consisting of combinations of materials, processing parameters, sequencing and device structures. Automated characterization systems are used to characterize the substrates processed by its Tempus HPC processing tools. Informatics and analysis software are used to automate experiment generation, characterization, data analysis and reporting.
The Company�� HPC platform consists of its Tempus HPC processing tools, automated characterization and informatics and analysis software. The Company�� platform is purpose-built for Research and Development (R and D) using combinatorial process systems. Combinatorial processing is a methodology for discovery and development that employs parallel and other high-throughput experimentation, which allows R and D experimentation to be performed at speeds up to 100 times faster than traditional methods. The Company�� processing tools allows performing up to 192 experiments on a single substrate.
Advisors' Opinion:- [By Sofia Horta e Costa]
ARM Holdings Plc (ARM) lost 2.6 percent, leading European technology companies lower before it publishes half-year results next week. IMI Plc (IMI) gained 2 percent as Citigroup Inc. listed the engineering company among its most preferred stocks.
Hot Chemical Companies To Own In Right Now: Fairchild Semiconductor International Inc (FCS)
Fairchild Semiconductor International, Inc. (Fairchild) focuses on developing, manufacturing and selling power analog, power discrete and certain non-power semiconductor solutions to a range of end market customers. The Company is a supplier of power analog products, power discrete products and energy-efficient solutions, according to iSuppli. Its products are used in a range of electronic applications, including sophisticated computers and Internet hardware; communications, including wireless phones; networking and storage equipment; industrial power supply and instrumentation equipment; consumer electronics, such as digital cameras, displays, audio/video devices and household appliances, and automotive applications.
The Company�� product groups are organized by the end markets, which include Mobile, Computing, Consumer and Communication (MCCC), Power Conversion, Industrial and Automotive (PCIA) and Standard Discrete and Standard Linear (SDT). It invested in the wafer fabrication power semiconductor technology, including low and mid voltage PowerTrench, advanced insulated gate bipolar transistor (IGBT), as well as advanced high power metal oxide semiconductor field effect transistors (MOSFET) fabrication technologies.
Mobile, Computing, Consumer and Communication (MCCC)
The Company designs, manufactures and markets high-performance analog and mixed signal integrated circuits, low voltage power MOSFETs for mobile, consumer, computing, and communication applications. It has a portfolio of PowerTrench technology products. Its analog and mixed signal products are focused on the mobile end- markets.
Analog products monitor, interpret, and control continuously variable functions, such as light, color, sound, and energy. It forms the interface with the digital world. It provides a range of analog products that perform such tasks as voltage regulation, audio amplification, power and signal switching and system management. Analog voltage regulation circ! uits are used to provide constant voltages, as well as step up or step down voltage levels on a circuit board. These products enable improvements in power efficiency, lighting management, and improve charge times in ultraportable products. These products are used in a variety of mobile, computing, communications and consumer applications.
In addition to the power analog and interface products, it also offers signal path products. These include analog and digital switches, universal serial bus (USB) switches, video filters and high performance audio amplifiers. The analog switch functions are typically found in cellular handsets and other ultra portable applications. The video products provide a single chip solution to video filtering and amplification. Video filtering applications include set top boxes and digital television. Its solutions include surface mount devices, tiny packages, chip scale packages, and leadless carriers.
The Company also design, manufacture and market power semiconductor solutions for computing, communications, mobile, consumer and industrial applications. Power semiconductor solutions include, power discrete MOSFETs, analog integrated circuits, and fully integrated multi-chip and monolithic power solutions. Its power MOSFETs are primarily used in power delivery and power control applications. Power delivery and control applications are ubiquitous across data consumption, processing and communication applications. It produces advanced low power MOSFETs under its PowerTrench brands. The advanced power MOSFETs applications are used in smartphones, tablets, notebook personal computer, high performance gaming, home entertainment systems, servers, data communication, and routers.
The Company competes with Analog Devices, Inc., Linear Technology Corporation, Maxim Integrated Product, Inc., Micrel Inc, ON Semiconductor Corporation, ST Microelectronics N.V., Intersil Corporation, International Rectifier Corporation, Infineon Technologies AG and T! exas Inst! ruments Incorporated.
Power Conversion, Industrial and Automotive (PCIA)
Fairchild design, manufacture and market power discrete semiconductors, analog and mixed signal integrated circuits (ICs) for broad power conversion/power management, industrial, and automotive applications. Its products are building blocks that help convert a semi-regulated energy source (alternating current (AC)or direct current (DC)) to a regulated output for electronic systems (AC-DC, DC-AC, and DC-DC conversion). Its discrete devices are individual diodes or transistors that perform power switching, power conditioning and signal amplification functions in electronic circuits. The Company�� analog and mixed signal integrated circuits (IC) are used to control discrete semiconductors in applications, such as power switching, conditioning, signal amplification, power distribution and power consumption. It manufacture discrete products using vertical DMOS MOSFETs, Insulated Gate Bipolar Transistors (IGBT), Bipolar, and ultrafast rectifier technologies. It manufacture analog and mixed signal ICs using a range of bipolar (Bi), complementary metal oxide (CMOS), BiCMOS, and bipolar/CMOS/DMOS (BCDMOS) processes up to 1,200 volts and down to 0.35um (microns) minimum geometry.
Power MOSFETs are used in applications to switch, shape or transfer energy. These products are used in a range of high-growth applications, including solar inverters, uninterruptible power supplies (UPS), data centers and communications, motors, lighting, automotive, computing, displays and industrial supplies. It produce advanced power MOSFETs under its SupreMOS, SuperFET, PowerTrench, UniFET and QFET brands. IGBTs are high-voltage power discrete devices. They are used in switching applications for solar inverters, uninterruped power supply, data centers and communications, motors, industrial, power supplies, displays, television and automotive ignition systems. These applications require lower switching frequencies, highe! r power, ! and/or higher voltages than a power MOSFET can provide. It is a supplier of IGBTs. Rectifier products work with IGBTs and MOSFETs in many applications to provide power conversion and conditioning. Its product is the STEALTH rectifier, providing industry performance and efficiencies in data communications, industrial power supply, displays, television, and motor applications.
Leveraging its power MOSFET and IGBT technologies, it also design and manufacture modules for the industrial, automotive, and home appliance end markets. It design and develop a line of smart power modules (SPM) products targeted to various end applications in consumer white goods and industrial applications, which include room air conditioners, industrial power supplies, solar inverters, pumps, and industrial motors. These are multi-chip modules containing up to 28 components in a single package that includes diodes, power discrete IGBTs or MOSFETs, high voltage power management driver ICs and current and temperature sensors. Similar modules, called APM, are used in automotive applications.
The Company design and manufacture power management semiconductors for line-powered and off-line powered systems that integrate its Power MOSFETs. It sell and market off-line and isolated DC-DC ICs, MOSFET and IGBT gate driver ICs, and power factor correction ICs to the consumer, computing, display, television, lighting and industrial segments.
The Company competes with Infineon Technologies AG, ST MicroelectronicsN.V., International Rectifier Corporation, Toshiba Corporation, Mitsubishi Corporation, Texas Instruments Incorporated, Power Integrations, Inc., ON Semiconductor Corporation, NXP Semiconductors N.V. and Vishay Intertechnology, Inc.
Standard Linear and Standard Discrete (SDT)
Standard Diodes and Transistors products cover a range of semiconductor products, including MOSFET, junction field effect transistors (JFETs), high power bipolar, discrete small signal transistors, TVS,! Zeners, ! rectifiers, bridge rectifiers, Schottky devices and diodes. The Company design, manufacture and market analog integrated circuits for computing, consumer, communications, ultra-portable and industrial applications. These products are manufactured using bipolar, CMOS and BiCMOS technologies. Standard Linear solutions range from bipolar regulators, shunt regulators, low drop out regulators, standard op-amp/comparators, low voltage op-amps, and others. Analog voltage regulator circuits are used to provide constant voltages, as well as to step up or step down voltage levels on a circuit board. Op-amps/comparators are designed specifically to operate from a single power supply over a range of voltages. It also offer low-voltage op-amps that provide a combination of low power, rail-to-rail performance, low voltage operation, and tiny package options which are well suited for use in personal electronics equipment. Its solutions include surface mount devices, tiny packages and leadless carriers.
The Company competes with International Rectifier Corporation, Diodes Incorporated, NXP Semiconductors N.V., ST Microelectronics N.V., ON Semiconductor Corporation, Texas Instruments Incorporated, Vishay Intertechnology, Inc., Vishay Intertechnology, Inc, Osram Opto Semiconductors, OPTEK Technology, OMRON Corporation, Avago Technologies Ltd. and Kodenshi Corp.
Advisors' Opinion:- [By Alex Planes]
In an epochal paper published in Electronics magazine on April 19, 1965 and simply titled "Cramming more components onto integrated circuits," Fairchild Semiconductor (NYSE: FCS ) director of research Gordon E. Moore wrote (emphasis mine):
- [By Alex Planes]
Gordon Moore and Robert Noyce were part of the founding team behind Fairchild Semiconductor (NYSE: FCS ) in 1957. In 11 years, the two men would forge legendary hardware-engineering careers. They developed the first practical integrated circuits, created the most widely recognized "law" of computing power, and built the chips that helped man land on the moon. But after 11 years, the two chip makers left the plodding Fairchild behind for even greater ambitions. On July 18, 1968, they founded Intel (NASDAQ: INTC ) , a company that would quickly and vastly eclipse their former employer.
- [By Alex Planes]
British radar engineer Geoffrey Dummer first made public the concept of integrated circuits on May 7, 1952. This was still years before practical transistor-based electronics would hit the consumer market, but the notion caught on with two very talented engineers: Robert Noyce, founder of Fairchild Semiconductor (NYSE: FCS ) , and Jack Kilby of Texas Instruments. Working independently, the two men would help build the entire semiconductor industry from the ground up, using Dummer's concepts as a starting point.
- [By Brian Pacampara]
What: Shares of power chip specialist Fairchild Semiconductor (NYSE: FCS ) sank 10% today after its quarterly results and outlook missed Wall Street expectations.
Top 10 Semiconductor Stocks For 2015: AT & S Austria Technologie & Systemtechnik AG (AUS)
AT & S Austria Technologie & Systemtechnik AG (AT&S) is an Austria-based company that is principally engaged in the production of printed circuit boards. The Company is divided into three core business units: Mobile Devices; Automotive, and Industrial. The Company�� product assortment ranges from single- and double-sided printed circuit boards to multilayer printed circuit boards. They are used as electromechanical linking elements, mainly in the telecommunication sector, automobile industry and medical technology applications, as well as defense and aerospace. AT&S operates production sites in Austria, India, China and Korea. It also maintains international sales offices, based in Austria, Ireland, Germany, the Czech Republic, France, Hungary and Belgium. As of March 31, 2011, the Company operated through its subsidiaries in India, Germany, Austria, China, Hong Kong, Japan, South Korea, Taiwan and the United States. Advisors' Opinion:- [By Triska Hamid]
Professors at the American University of Sharjah (AUS) are also looking at dental care with braces imbedded with a chip that monitor the movement of the fixtures and will communicate with the dentist's office if any of them are separated from the teeth.
Top 10 Semiconductor Stocks For 2015: Micron Technology Inc.(MU)
Micron Technology, Inc., together with its subsidiaries, engages in the manufacture and marketing of semiconductor devices worldwide. Its products include dynamic random access memory (DRAM) products that provide data storage and retrieval, which include DDR2 and DDR3; and other specialty DRAM memory products, including DDR, SDRAM, DDR and DDR2 mobile low power DRAM, pseudo-static RAM, and reduced latency DRAM. The company also offers NAND flash memory products, which are electrically re-writeable and non-volatile semiconductor devices that retain content when power is turned off. In addition, it provides NOR flash memory products that are electrically re-writeable and non-volatile semiconductor memory devices; phase change memory products; and image sensor products. Micron Technology?s products are used in a range of electronic applications, including personal computers, workstations, network servers, mobile phones, flash memory cards, USB storage devices, digital still c ameras, MP3/4 players, and in automotive applications. It sells its products to original equipment manufacturers and retailers through internal sales force, independent sales representatives, and distributors, as well as through a Web-based customer direct sales channel. The company was founded in 1978 and is headquartered in Boise, Idaho.
Advisors' Opinion:- [By Piyush Arora]
This, of course, presents a bullish outlook for Apple. But, iPhone's hardware and software suppliers, namely�Micron (NASDAQ: MU ) , Jabil Circuit (NYSE: JBL ) , and Electronic Arts (NASDAQ: EA ) , also stand to benefit here. Do these stocks deserve a place in your portfolio?
- [By Genesis Housing]
This is akin to writing a bear note on Apple (AAPL) but ignoring the iPhone, or Micron (MU) but ignoring Elpida (ELPDF.PK).
Sell side research based on incomplete analysis that calls into question a company's cash flows and cash position does a disservice to investors who might be turned off looking into the investment case of Nokia. To present such obviously incomplete analysis and make conclusions that will influence investors is an analogy for many of the misgivings people have about the way the sell side operates. It also gives credence to other more innovative ways to collect and extract insight on industries and businesses such as Seeking Alpha.
Top 10 Semiconductor Stocks For 2015: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By David Dittman]
Crown Resorts is a buy all the way up to USD16.50 on the Australian Securities Exchange (ASX) using the symbol CWN and on the US over-the-counter (OTC) market using the symbol CWLDF.
Top 10 Semiconductor Stocks For 2015: Camtek Ltd (CAMT)
Camtek Ltd. (Camtek), incorporated in 1987, designs, develops, manufactures and markets automated solutions dedicated for enhancing production processes and yield for the semiconductor manufacturing and packaging and the printed circuit board (PCB) and integrated circuit (IC) substrate industries. Camtek also designs, develops, manufactures and markets automated optical inspection (AOI), systems and related products. The Company�� AOI systems are used to enhance both production processes and yields for manufacturers in the semiconductor manufacturing and packaging industry and PCB and IC Substrate industry. Through the acquisition of Printar's assets, it also engaged in developing, manufacturing, sale and marketing of direct digital material deposition systems and inks for the PCB industry, with two major fields of activity: Solder Mask and Legend. In addition, through the acquisition of Sela, it is also engaged in the development, manufacturing and marketing of automated scanning electron microscope (SEM) and transmission electron microscope (TEM) sample preparation equipment, primarily for the semiconductor industry.
As of December 31, 2011, the Company had sold more than 2,500 AOI systems in 34 countries worldwide. The Company's PCB customer base includes the majority of the 100 PCB manufacturers worldwide. As of December 31, 2011, it had sold over 300 Falcon systems to more than 25 semiconductor manufacturers, among them outsourced semiconductor assembly and test (OSAT), integrated device manufacturers (IDM) and wafer level packaging subcontractors, including eight out of the top 10 semiconductors companies.
Camtek�� AOI systems consist of an electro-optical assembly unit, either movable or fixed, which consists of a video camera, precision optics and illumination sources. The electro-optical unit captures the image of the inspected product; a precise, either movable or fixed table, that holds the inspected product, and an electronic hardware unit, which operates the! entire system and includes embedded components that process and analyze the captured image by using its algorithms. Its systems can also compile and communicate statistical reports of inspection findings through the customer�� factory information system. The Company offers a range of systems for automated optical inspection of semiconductor wafers, IC substrates and PCBs. These systems are used to enhance production yields and assist in controlling manufacturing processes at wafer fabrication, test and assembly houses, and PCB plants worldwide.
The Company�� Falcon systems are designed for the back end market of the semiconductor industry. The Falcon�� advanced algorithms and inspection capabilities enable its dedicated models to detect defects in the die, which, if left undetected, may cause failure. The Condor is designed to meet the current and future inspection needs of the semiconductor industry. The Condor, through algorithms and advanced hardware configuration, is designed to enhance two dimensional (2D) and three dimensional (3D) detection abilities and increased throughput. The Condor family includes models for: 3D and 2D metrology and inspection of bumped-wafer prepared for packaging in the flip-chip technology; 2D metrology and inspection of finished wafers at the end of their manufacturing process and in test houses; Post-dicing inspection of frame-mounted wafers at assembly and packaging facilities, where it adds the value of detecting dicing-related damage, and inspection and metrology of micro-electro mechanical systems (MEMS) and other special applications.
Condor 5LED is an AOI system designed to provide solutions to a range of requirements that are to light emitting diode (LED) semiconductor manufacturers. The LED market�� special inspection requirements are characterized by 3-6 inch wafers, each of which may contain between 100 to over 200 thousand LED devices per wafer. Typically, the wafer is made of a translucent compound semiconductor, such as g! allium ar! senide, gallium phosphide and/or indium phosphide. The Gannet system is designed for the front end market of the semiconductor industry.
The Company�� AOI products for this industry consist of five product lines: the Phoenix, Dragon and Orion for the inspection of inner and outer layers of PCB panels and ultra-fine-line IC substrate; large area masks (LAM) dedicated for inspection of artwork; and the Pegasus for final inspection (AFI) of IC substrates and high density interconnect (HDI) panels. The Phoenix product family, introduced in November 2011, is designed to support a range of the demanding PCB and IC substrate applications, while keeping in pace with the dynamic technology changes in the industry. The Phoenix product family is enhanced with Spark - Camtek's and detection engine providing high detection capabilities, while minimizing false calls.
Dragon systems are high-throughput, automation-ready systems for inspection of all PCB types in a mass production environment. Dragon models are optimized for specific PCB technology ranges - from mainstream circuits of typically 100 (microns) conductor line width, up to high density substrates having 12 (microns) wide conductive lines. All Dragon models are designed to interface with automated material handling mechanisms provided by the Company or other automation suppliers. Orion systems are stand-alone AOI systems for high volume inspection of all PCB types designed to operate in inspectify mode of operation. Inspectify is a mode of operation enabling the operator to perform verification immediately after inspection on the same system, thus saving time and eliminating handling-related defects.
LAM is specially designed for main-stream LAM inspection. It offers unparalleled detection ability on LAM with down to 25 (microns) line/space width technology. The LAM incorporates advanced technology innovations to ensure the level of detection that these masks require at this critical production stage. Camtek offers! various ! stand-alone verification systems that enable verification of panels after inspection. The Pegasus line includes systems for automated inspection of finished IC substrates that are subsequently used in packaging of ball grid array (BGA) and Chip Scale Package (CSP) devices. The Pegasus inspects both sides of the substrate, detecting process and mechanical defects, in particular in the gold-plated areas, where the substrate will interconnect with the silicon die or the PCB, and in the solder-mask areas. Pegasus models handle substrates in strip format in magazines.
GreenJet is a SM digital printing system aimed to replace the conventional SM application lines for prototypes and high mix low volume production. The GreenJet system offers manufacturers flexible and digital SM printing technology solution. The LGP system incorporates PCB digital legend printing technologies with specially developed heat curable ink, resulting in output and system performance. Camtek has developed the inks for both LGP and GreenJet, which involves different chemicals mixed together in order to reach the required ink characterization.
The Company competes with Rudolph Technologies Inc., KLA-Tencor Corporation, Topcon Corporation, Toray Industries, Inc., Hitachi Ltd., Nidec Tosok Corporation., FEI Company, SII Nanotechnology Japan, Carl Zeiss, Inc., Orbotech Ltd., Dainippon Screen Manufacturing Company, Lloyd-Doyle Limited, Gigavis Co. Ltd., ATI Electronics Pty Ltd., Shirai Electronics Industrial Co. Ltd., First EIE SA and MicroCraft K.K.
Advisors' Opinion:- [By Paul Ausick]
Shares of tech industry testing and inspection systems maker Camtek Ltd. (NASDAQ: CAMT) closed at $1.89 on November 7th, the day the company announced third-quarter earnings. It closed at $2.65 last Friday and skyrocketed to a high of $6.43 on Tuesday before dropping back to around $4.00 in Wednesday trading.
- [By Paul Ausick]
Stocks on the Move: Ariad Pharmaceuticals Inc. (NASDAQ: ARIA) is up 35.7% at $5.13. Camtek Inc. (NASDAQ: CAMT) is up 71.7% at $4.55 after saying that a 3D printer is coming next year from the company. Sungy Mobile Ltd. (NASDAQ: GOMO) is up 28.8% at $17.19 after last Friday�� IPO. InterCloud Systems Inc. (NASDAQ: ICLD) is down 28.2% at $9.20.
Top 10 Semiconductor Stocks For 2015: Sunedison Inc (SUNE)
SunEdison Inc, formerly MEMC Electronic Materials, Inc., incorporated on October 1, 1984, is engaged in the development, manufacture and sale of silicon wafers. The Company is a developer and seller of photovoltaic energy solutions. Through Solar Materials and Solar Energy (SunEdison), it is a developer of solar energy projects. The Company operates in two segments: semiconductor materials and solar energy. The Company�� Solar Energy segment includes the operations of its old Solar Materials segment, as well as its SunEdison business. In the Semiconductor Materials, the Company offers wafers with a variety of features. The Company�� wafers vary in size, surface features, composition, purity levels, crystal properties and electrical properties.
Semiconductor Materials
The Company�� monocrystalline wafers for use in semiconductor applications range in size from 100 millimeter to 300 millimeter and are round in shape for semiconductor customers because of the nature of their processing equipment. Its wafers are used as the starting material for the manufacture of various types of semiconductor devices, including microprocessor, memory, logic and power devices. In turn, these semiconductor devices are used in computers, cellular phones and other mobile electronic devices, automobiles and other consumer and industrial products. Its monocrystalline wafers for semiconductor applications include four general categories of wafers: prime, epitaxial, test/monitor and silicon-on-insulator (SOI) wafers.
The Company�� prime wafer is a polished, pure wafer with an ultraflat and ultraclean surface. The Company�� epitaxial (epi), wafers consist of a thin silicon layer grown on the polished surface of the wafer. Typically, the epitaxial layer has different electrical properties from the underlying wafer. This provides customers with isolation between circuit elements than a polished wafer. Its AEGIS product is designed for certain specialized applications requiring high resis! tivity epitaxial wafers and its MDZ product feature. The AEGIS wafer includes a thin epitaxial layer grown on a standard starting wafer. The AEGIS wafer�� thin epitaxial layer eliminates harmful defects on the surface of the wafer, thereby allowing device manufacturers to increase yields. The Company supplies test/monitor wafers to its customers for use in testing semiconductor fabrication lines and processes. An SOI wafer is a different starting material for the chip making process.
Solar Energy
The Company�� Solar Energy segment provides solar energy services that integrate the design, installation, financing, monitoring, operations and maintenance portions of the downstream solar market to provide a solar energy service to its customers. As of December 31, 2012, SunEdison interconnected over 675 solar power systems representing 989 megawatt of solar energy generating capacity. As of December 31, 2012, SunEdison had 73 megawatt of projects under construction and 2.6 gigawatts in pipeline. In support of its downstream solar business, its Solar Energy segment manufactures polysilicon, silicon wafers and solar modules. Additionally, its Solar Energy segment will sell solar modules to third parties in the event the opportunity aligns with itsinternal needs. It provides its downstream customers with a way to purchase renewable energy by delivering solar power under long-term power purchase arrangements with customers or feed-in tariff arrangements with government entities and utilities. Its SunEdison business is dependent upon government subsidies, including United States federal incentive tax credits, state-sponsored energy credits and foreign feed-in tariffs. The Company�� solar wafers are used as the starting material for crystalline solar cells.
The Company competes with Shin-Etsu Handotai, SUMCO, Siltronic and LG Siltron, SunPower Corporation, First Solar, Inc., Enerparc, Sharp Corporation (Recurrent Energy), Phoenix Solar, BELECTRIC, JUWI Solar Gmbh, and S! olar City! .
Advisors' Opinion:- [By Lisa Levin]
SunEdison (NYSE: SUNE) shares surged 0.50% to reach a new 52-week high of $13.99. SunEdison's trailing-twelve-month revenue is $2.06 billion.
Posted-In: 52-Week HighsNews Intraday Update Markets Movers
- [By James Brumley]
What’s going to spark such a run-up from SOL stock at some point in 2014? Aaron Levitt offered details in his commentary on ReneSola, but the short version is that the panel maker has developed a strong name for itself as a supplier for small, independent power producers that are more cost-conscious than bigger players.
Sunedison (SUNE)While Sunedison (SUNE) is a name that occasionally surfaces during discussions of the market’s top solar stocks, it’s not always part of the debate.
- [By Aaron Levitt]
Utility NextEra Energy (NEE) is the nation�� largest solar and wind operator and just the latest firm to announce its intention to create a YieldCo. Moody�� estimates that about 30 utilities across the globe have the ability to create a YieldCo today based on current power plant holdings. Aside from the utility space, the various solar panel producers that also own/build grid-scale operations have also expressed their intentions about starting YieldCos. These include SunPower (SPWR) and SunEdison (SUNE).
- [By Ben Levisohn]
Not investors in Restoration Hardware (RH). Its shares have dropped 2% in after-hours trading after it reported a profit of 49 cents a share, above forecasts for 43 cents, but offered mixed guidance. Oxford Industries (OXM) is off 7.3% at $60 after it announced a profit of $1.01, ahead of 98 cents consensus forecasts, but lowered its 2013 guidance. Shares of SunEdison (SUNE) have dropped 5.4% to $7.90 after it announced a secondary offering.
Top 10 Semiconductor Stocks For 2015: Advanced Photonix Inc (API)
Advanced Photonix, Inc. (API), incorporated in June 22, 1988, is engaged in the development and manufacture of optoelectronic devices and value-added sub-systems and systems. The Company serves a variety of global original equipment manufacturers (OEMs) in a variety of industries. API supports its customers from the initial concept and design phase of the product, through testing to full-scale production. API has two manufacturing facilities located in Camarillo, California and Ann Arbor, Michigan. API is a supplier of optoelectronic semiconductors packaged into high-speed optical receivers, custom optoelectronic subsystems and Terahertz instrumentation, serving a variety of global OEM markets. API supports the customer from the initial concept and design of the semiconductor, hybridization of support electronics, packaging and signal conditioning or processing from prototype through full-scale production and validation testing. The target markets served by it are industrial sensing/NDT, military/aerospace, telecom, medical and homeland security. On March 1, 2013, it acquired certain assets of Silonex, Inc.
The Company�� high-speed optical receivers include avalanche photodiode (APD) technology and positive-intrinsic-negative (PIN) photodiode technology based upon III-V materials, including InP, InAlAs, and GaAs. Its optoelectronic subsystems are based on its silicon large area avalanche photodiode (LAAPD), PIN photodiode, FILTRODE detectors and light emitting diode (LED) assemblies. API�� Terahertz sensor product line is targeted at the industrial homeland security and military markets. Using its fiber coupled technology and high speed Terahertz generation and detection sensors, the Company is engaged in transferring Terahertz technology from the laboratory to the factory floor for use in non-destructive testing and real time quality control.
The Company competes with First Sensor, Illinois Tool Works, JDS Uniphase, Neophotonix, U2T and Nippon Electric.
Advisors' Opinion:- [By Patricio Kehoe]
In 2010, the company acquired privately held Nimsoft, a provider of IT performance monitoring solutions for $350 million in cash. In Sep 2010, CA signed a definitive agreement to acquire Hyperformix Inc. Recently; it acquired Layer 7 Technologies, a leading provider of Application Programming Interface (API) security and management. Furthermore, the acquisition of Arcot Systems Inc., a privately held company that provides authentication and fraud prevention software, in a move to boost its security offerings. These acquisitions have helped the firm to strengthen its cloud computing infrastructure and would also help to generate better profitability from the existing technology assets.
Top 10 Semiconductor Stocks For 2015: Malaysian Pacific Industries Bhd (MPI)
Malaysian Pacific Industries Berhad (MPI) is an investment holding company. The principal activities of MPI, through its subsidiaries are manufacturing, assembling, testing and sale of integrated circuits, semiconductor devices, electronic components and lead frames to customers globally. The Company�� operating geographical segments include Asia, The United States of America, and Europe. The Company's subsidiaries include Carsem (M) Sdn Bhd, Recams Sdn Bhd, Carsem Holdings Limited, Carsem Semiconductor (Suzhou) Co., Ltd, Dynacraft Industries Sdn Bhd, Carter Realty Sdn Bhd, Carter Realty Sdn Bhd and Carsem Holdings (HK) Limited. Advisors' Opinion:- [By Sofia Horta e Costa]
Michael Page International Plc (MPI) increased 1.1 percent to 490.2 pence after Goldman Sachs Group Inc. upgraded the stock to buy from neutral, saying the recruitment firm will benefit from a pick-up in the European economy.
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